High Density Plasma Reactive Ion Etching System

                  

              update:2016/01/25                

Instrument name High Density Plasma Reactive Ion Etching System (HDP-RIE)
Brand Model

Duratech

Purchase Date

1997
Seat Solid-State Electronics Building 1F 116R (TEL:55666

Services

Dry Etching for Al

Specifications

1. Etch material: Al.

2. Wafer size: 4 inch.

3. System features: One etch chamber and two vacuum pumps.

4. Operation modes:Automatic or manual.

Open Level

Open Level, Open people

Contact people

1.Professor:Chen, Kuan-Neng   (TEL:03-5712121-31588)

2.Maintenance Technician: Hu, Jack  (TEL03-5712121-5560755666)

3.Instrument Operator: Chen, Ming-Li   (TEL:03-5712121-55672, 55666)

Operation appointment

National Sceince Council

The Instruments Information System

Original Equipment Manufacturer

Training Manual &

Quality Examination

Charge Fee
 

School

Research Institute

Commercial Agency

Original Equipment Manufacturer(NT$/2hr) 900 - -

Primary charge(NT$/hr)

2300 2300 2600

Operating charge(NT$/hr)

2300 2300 2600